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Freescale Semiconductor Technical Data
MPXV7002 Rev 1.0, 09/2008
Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
The MPXV7002 series piezoresistive transducers are state-of-the-art monolithic silicon pressure sensors designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. Features * * * * * * * 2.5% Typical Error over +10C to +60C with Auto Zero 6.25% Maximum Error over +10C to +60C without Auto Zero Ideally Suited for Microprocessor or Microcontroller-Based Systems Thermoplastic (PPS) Surface Mount Package Temperature Compensated over +10 to +60C Patented Silicon Shear Stress Strain Gauge Available in Differential and Gauge Configurations
MPXV7002 SERIES
INTEGRATED PRESSURE SENSOR -2 to 2 kPa (-0.3 to 0.3 psi) 0.5 to 4.5 V OUTPUT SMALL OUTLINE PACKAGE
MPXV7002GC6U CASE 482A-01
Typical Applications * * * * Hospital Beds HVAC Respiratory Systems Process Control ORDERING INFORMATION
Device Type Options Case No. 482A 482A 1369 1351 1351 MPX Series Order No. MPXV7002GC6U Packing Options Rails Device Marking MPXV7002G 1 2 3 4 MPXV7002GP CASE 1369-01 MPXV7002DP CASE 1351-01
SMALL OUTLINE PACKAGE PIN NUMBERS(1)
N/C VS Gnd Vout 5 6 7 8 N/C N/C N/C N/C
Ported Gauge, Axial Port, SMT Elements Gauge, Axial Port, SMT Gauge, Side Port, SMT Differential, Dual Port, SMT Differential, Dual Port, SMT
MPXV7002GC6T1 Tape & MPXV7002G Reel MPXV7002GP MPXV7002DP MPXV7002DPT1 Trays MPXV7002G Trays MPXV7002DP Tape & MPXV7002DP Reel VS
1. Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead.
Sensing Element
Thin Film Temperature Compensation and Gain Stage #1
Gain Stage #2 and Ground Reference Shift Circuitry
Vout
GND
Pins 1 and 5 through 8 are NO CONNECTS for surface mount package
Figure 1. Fully Integrated Pressure Sensor Schematic
(c) Freescale Semiconductor, Inc., 2005, 2008. All rights reserved.
Table 1. Maximum Ratings(1)
Rating Maximum Pressure (P1 > P2) Storage Temperature Operating Temperature Symbol Pmax Tstg TA Value 75 -30 to +100 10 to +60 Unit kPa C C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Table 2. Operating Characteristics (VS = 5.0 Vdc, TA = 25C unless otherwise noted. Decoupling circuit shown in Figure 3 required to meet specification.)
Characteristic Pressure Range(1) Supply Voltage(2) Supply Current Pressure @ VS = 5.0 Volts Offset(3) (10 to 60C) (10 to 60C) (10 to 60C) (10 to 60C) Symbol POP VS Io Voff VFSO VFSS -- V/P Time(8) tR IO+ -- Min -2.0 4.75 -- 2.25 4.25 3.5 -- -- -- -- -- Typ -- 5.0 -- 2.5 4.5 4.0 2.5(7) 1.0 1.0 0.1 20 Max 2.0 5.25 10 2.75 4.75 4.5 V 6.25 --------Unit kPa Vdc mAdc Vdc Vdc Vdc %VFSS V/kPa ms mAdc ms
Full Scale Output(4) @ VS = 5.0 Volts Full Scale Span(5) @ VS = 5.0 Volts Accuracy(6) Sensitivity Response
Output Source Current at Full Scale Output Warm-Up Time(9) 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6. Accuracy (error budget) consists of the following: * Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. * Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. * Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25C. * TcSpan: Output deviation over the temperature range of 10 to 60C, relative to 25C. * TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 10 to 60C, relative to 25C. * Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25C. 7. Auto Zero at Factory Installation: Due to the sensitivity of the MPXV7002 Series, external mechanical stresses and mounting position can affect the zero pressure output reading. Auto zero is defined as storing the zero pressure output reading and subtracting this from the device's output during normal operations. Reference AN1636 for specific information. The specified accuracy assumes a maximum temperature change of 5C between auto zero and measurement. 8. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 9. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.
MPXV7002 2 Sensors Freescale Semiconductor
ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
The performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single monolithic chip. Figure 2 illustrates the Differential or Gauge configuration in the basic chip carrier (Case 482). A gel die coat isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The MPXV7002 series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Figure 3 shows the recommended decoupling circuit for interfacing the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Figure 4 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 10 to 60C using the decoupling circuit shown in Figure 3. The output will saturate outside of the specified pressure range.
Fluoro Silicone Gel Die Coat P1 Wire Bond Lead Frame
Die
Stainless Steel Cap
+5 V
Thermoplastic Case
Vout Vs IPS 1.0 F 0.01 F GND
OUTPUT
470 pF
P2 Differential Sensing Element
Die Bond
Figure 2. Cross-Sectional Diagram SOP (not to scale)
Figure 3. Recommended Power Supply Decoupling and Output Filtering (For additional output filtering, please refer to Application Note AN1646.)
5.0
4.0 Output Voltage (V) 3.0
Transfer Function: Vout = VS x (0.2 x P(kPa)+0.5) 6.25% VFSS VS = 5.0 Vdc TA = 10 to 60C TYPICAL
2.0 1.0 0
MAX MIN
-2
-1
0 Differential Pressure (kPa)
1
2
Figure 4. Output versus Pressure Differential
MPXV7002 Sensors Freescale Semiconductor 3
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing a gel die coat which protects the die from harsh media.
Part Number MPXV7002GC6U/GC6T1 MPXV7002GP MPXV7002DP
The Pressure (P1) side may be identified by using the table below:
Case Type 482A-01 1369-01 1351-01
Pressure (P1) Side Identifier Vertical Port Attached Side with Port Attached Side with Part Marking
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads.
0.660 16.76
0.100 TYP 8X 2.54
0.060 TYP 8X 1.52
0.300 7.62
0.100 TYP 8X 2.54
inch mm
SCALE 2:1
Figure 5. Small Outline Package Footprint
MPXV7002 4 Sensors Freescale Semiconductor
PACKAGE DIMENSIONS
-A4 5
D
8 PL
0.25 (0.010)
M
TB
S
A
S
N
-BG
8 1
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0 7 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0 7 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17
S
W
V C H J K M
PIN 1 IDENTIFIER
-TSEATING PLANE
DIM A B C D G H J K M N S V W
CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE
MPXV7002 Sensors Freescale Semiconductor 5
PACKAGE DIMENSIONS
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CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE
MPXV7002 6 Sensors Freescale Semiconductor
PACKAGE DIMENSIONS
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CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE
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PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE
MPXV7002 8 Sensors Freescale Semiconductor
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE
MPXV7002 Sensors Freescale Semiconductor 9
How to Reach Us:
Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 1-800-521-6274 or +1-480-768-2130 www.freescale.com/support Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) www.freescale.com/support Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064 Japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com Asia/Pacific: Freescale Semiconductor China Ltd. Exchange Building 23F No. 118 Jianguo Road Chaoyang District Beijing 100022 China +86 010 5879 8000 support.asia@freescale.com For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1-800-441-2447 or +1-303-675-2140
Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals", must be validated for each customer application by customer's technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. FreescaleTM and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. (c) Freescale Semiconductor, Inc. 2008. All rights reserved.
MPXV7002 Rev. 1.0 09/2008

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